giovedì 26 marzo 2015

Edoardo Cignoli : Intel, Micron Join Shift to 3-D Storage Chips

Intel and Micron Technology said they are shipping samples of jointly designed chips that stack circuitry in layers to boost storage capacity rather than packing smaller components on to a flat square of silicon.



via WSJ.com: US Business http://ift.tt/1GuP9nF

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